Next-Gen Xbox SoC Pictures Have Allegedly Been Leaked, Theoretical Performance Compared With PS6

by Muhammad Ali Bari

Early pictures of the next-gen Xbox console’s System-on-a-Chip (SoC), codenamed Magnus, have allegedly been leaked.

In his latest YouTube video, content creator and hardware insider Moore’s Law Is Dead (MILD) has shared what he claims are pictures of the next-gen Xbox Magnus SoC (see images below). He also delved into the chip’s leaked specs and compared them to the alleged specs of the PS6.

Xbox next-gen

Xbox Magnus SoC Specs

According to the insider, Xbox Magnus SoC is built on TSMC’s 4 nm process, with 16 Zen 5 CPU cores and 60 RDNA 5 GPU compute units. The console’s memory configuration allegedly includes 24 GB of GDDR7, offering a major bandwidth increase over the RAM seen in current-gen hardware. MILD noted that the leak suggests Microsoft is abandoning the cost-conscious “cheaper, weaker box” approach it pursued with Xbox Series S. Instead, Magnus appears positioned as high-end flagship hardware designed to match or surpass PS6’s baseline SKU. He believes that the software giant may seek to launch Magnus either simultaneously with or slightly ahead of Sony in order to attempt to regain lost momentum.

Xbox next-gen

Next-Gen Xbox vs PS5 Performance Comparison

Based on the leaked information and the analysis from Moore’s Law Is Dead, Xbox Magnus and PlayStation 6 appear to be positioned even closer in performance than their predecessors. While final clock speeds and SKU variations are still unconfirmed, both consoles allegedly use Zen 5 CPU architecture paired with RDNA 5 GPUs, but Magnus seems to have a slight edge in GPU compute unit count (around 60 CUs compared to the rumored 56–60 CUs on the baseline PS6 model).

While this potentially gives Microsoft a marginal advantage in raw graphics throughput, Sony is expected to counter with more mature developer tools and deep hardware-software optimization. Moore’s Law Is Dead noted that while Magnus may win on paper specs, real-world performance may come down to clock speeds, memory configuration, and how aggressively each company pushes its thermal and power envelopes.

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