The new Xbox Series X 2TB and Digital Edition consoles feature a System on Chip (SoC) die shrink as well as a brand new cooling system, based on the latest information.
In his latest video, YouTuber Austin Evans, who is known for his hardware and gadget tests and reviews, has conducted a teardown of the new Xbox Series X Digital Edition, revealing that it as well as all 2024 models of the console come with an SoC die shrink and a new cooling system.
Heat Sink
Evans’ teardown of the Xbox Series X Digital Edition revealed large copper heat pipes on its heat sink, similar to what’s found in the PlayStation 5, which is different from the heat sink in the original version of the console. The launch version did not use heat pipes, relying instead on a vapor chamber. These changes appear to apply across all 2024 models. The new cooler is lighter, weighing 700 grams compared to the original’s 804 grams, owing to the weight reduction coming from the switch from a vapor chamber to the more traditional heat pipe cooler. According to Evans, the new cooler appears to be made of aluminum or steel instead of copper, though further testing would be required to know for sure.
SoC Die Shrink
While a vapor chamber is technically a superior cooling solution, it’s also more expensive. The decision to go with a less effective and cheaper cooling solution ties into the other major hardware change seen in the Xbox Series X Digital Edition teardown, which is the SoC die shrink. The new console features a 6nm chip, a shrunken version of the original Xbox Series X SoC. It makes the console cheaper to manufacture while maintaining the same clock speeds. The reduced voltage requirements of the smaller chip made way for the switch to a more traditional heat sink with copper heat pipes, eliminating the need for the more expensive vapor chamber.
